www.laboshop.com 6 1 2 3 4 5 1+2Eve Diasynt Plus Diamond Grinder Synthetic bond. For ZrO2 , lithium disilicate, veneering porcelains and feldspar ceramic. With abrasive power at minimum heat development. Thus, the diamond grinders are very materialsaving and reduce the risk of micro cracks. Shank ø 2.35 mm. 1 Grain coarse. 2Grain medium. 3Horico Hocera Diamond Grinder Ceramic bond. For the dry processing of ZrO2 , lithium disilicate, Al2 O3 , ceramic and metal. High dimensional stability, heat-resistant. Grain fine. Shank ø 2.35 mm. 4Horico Hosynt Diamond Grinder Synthetic bond. For the dry processing of ZrO2 , lithium disilicate and Al2 O3 . High abrasive performance, low heat development. Grain fine. Shank ø 2.35 mm. Fig. DYP-8g DYP-9g DYP-13g DYP-14g DYP-15g ISO ø 120 115 040 050 150 L in mm 2.0 3.0 10.0 13.0 3.0 647.819 647.829 647.831 647.849 647.859 each , , , , , Fig. DYP-8m DYP-9m DYP-13m DYP-14m DYP-15m ISO ø 120 115 040 050 150 L in mm 2.0 3.0 10.0 13.0 3.0 647.919 647.929 647.931 647.949 647.959 each , , , , , 5+6Heatless Grinding Discs For heatless cutting of acrylic teeth, acrylic and metal. Uniform usage down to the metal hub. No blunting caused by the intake of foreign particles. Not mounted. 5ø 25 mm, 50 pcs. 1 pack. 672.013 no. , thickness mm , 672.023 no. , thickness mm , 672.033 no. , thickness . mm , ø 22 mm, 50 pcs. 1 pack. 672.053 no. , thickness mm , 672.063 no. , thickness . mm , 6ø 19 mm, 50 pcs. 1 pack. 672.083 no. , thickness mm , Fig. H9738 H9739 H9740 H9741 H9742 ISO ø 220 120 035 048 115 L in mm 2 2 11 13 3 663.119 663.129 663.139 663.149 663.159 each , , , , , Fig. H9838 H9839 H9840 H9841 H9842 ISO ø 220 120 040 050 115 L in mm 2 2 10 13 3 663.169 663.179 663.189 663.199 663.209 each , , , , ,
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